Intel Announces that Embedded MRAM is Production Ready
Intel have given further details on its technique for embedding spin-transfer torque (STT)-MRAM into devices
External Storage Market Shows YoY Growth in Q3 2018
According to IDC, India’s external storage market witnessed a growth of 23.1% YoY and stood at USD 81.8 million in…
Supermicro rolls 1U petabyte NVMe system
The NVMe solution applies a new “ruler” form factor for Intel SSDs, which Supermicro claims provides more than double the…
NVMe 1.3 adds framework for metadata exchange
The update, which represents one of three core specifications for NVMe, encompasses 24 technical proposals that can be spread across…
Intel packs Optane module with 3D X-Point
A TechInsights teardown of an Intel Optane M.2 80mm 16GB PCIe 3.0 has revealed a 3D X-Point memory die in…
3D NAND SSDs target system builders, gamers
The 64-layer 3D NAND WD Blue SSDs are F.I.T. Lab certified, while the SanDisk Ultra 3D SSDs promise faster data…
SSD uses 64-layer BiCS Flash
Toshiba's XG5 series offers up to 1TB capacity packed into an M.2 form factor and targets mobile PCs and secure…
NAND flash co-inventor Mehrotra leads Micron
Micron has named former SanDisk CEO and co-inventor of NAND flash, Sanjay Mehrotra, as its president and CEO effective May…
DDR4 module supports overclocking to 3GHz
Apacer's Panther Rage DDR4 Illumination gaming memory module boasts a heat spreader, LED lighting and 3GHz overclocking.
ZestDAQ software simplifies DAQ, control apps
ZestDAQ provides common IP interfaces across multiple boards, which simplifies the porting of designs between USB and Ethernet modules.