Production-ready DDR4 PHY delivers 3.2Gbps data rate
Rambus is looking to meet the needs of the Facebooks and Instagrams of the world as their data centre requirements…
Samsung smartphones shine as Apple’s iPhones slip
Samsung has shipped about 72 million smartphones in the second quarter this year, although Apple still leads in terms of…
Semiconductor capex to see 0.7% drop in 2016
The PC, ultramobile and smartphone production forecast for the second half of 2016 has been lowered from 2015 as the…
IoT, AI, Softbank: 30 years hence
Analyst Jim McGregor notes that if anything, “the investment will bring innovation and lower prices to markets like IoT, networking,…
What does Softbank stand to gain in ARM bid?
EE Times' Junko Yoshida writes about what's in it for SoftBank in its recent plunking down of Rs.2.15 lakh crore…
Low-pin DRAM targets automotive, IoT memory needs
The 64Mb HyperRAM is designed to serve as an expanded scratchpad memory for high-resolution graphics of data-intensive firmware algorithms.
Micron stakes business on 3D NAND with new fab process
Micron has taken an innovative approach to shrinking the die area by placing active circuitry under the NAND array.
Self-refresh DRAM device reduces number of needed pins
The HyperRAM and HyperFlash solution reduces pin count by at least 28 pins, decreasing design complexity and lowering PCB cost.
Bringing performance to software-defined storage with NVMe
Typical enterprise storage buyers are accustomed to a somewhat-appliance like experience, but with software-defined storage, customers can use the hardware…
PCIe, DDR3 SDRAM IP subsystems target custom LSI platforms
The PCI Express cores from Toshiba include standard-compliant, full-featured PCI Express 3.0/2.1/1.1 cores and high-performance, scatter-gather DMA cores and drivers…