IBM, Tokyo Electron eye AI in chip manufacturing
With the broader aim to increase yields and reduce costs, IBM Research and Tokyo Electron are collaborating to inject cognitive…
InGaAs/SiGe CMOS doubles mobile device’s battery life
IBM researcher Veeresh Deshpande and his fellow scientists have demonstrated InGaAs/SiGe CMOS using processes for manufacturing on 300mm wafers.
LDRA integrates IBM Rational Doors for IoT app dev’t
LDRA tool suite and IBM Rational Doors Next Generation equip IoT system developers with traceability in OSLC environment and collaboration…
Climate app alerts sans operators
IBM and the Weather Co. have developed the Weather Channel App that uses P2P mesh communication to deliver climate alerts…
Cricket exit poised to be third strike for India
Foreign players are wooing Cricket Semiconductor to build the analog and power pure-play foundry in their region.
MEMS, sensor steer mental health analysis
With hyperspectral imaging, it is possible to spot hidden dangers such as contaminated food or black ice and obstacles shrouded…
CCIX spec addresses data centre connectivity
The consortium has chosen to use the PCI Express architecture as its first transport layer with additional higher speeds of…
IBM embedds voice interface for appliances
White goods makers are testing ways to embed into appliances links to data analytics for voice interfaces.
IBM discovers how to convert old smartphones cases into high-strength plastic
The one-step approach converts BPA-leaching plastics in consumer electronics into environmentally safe material for water purification and medical devices.