Challenges and Milestones in EUV
EUV lithography faces short-term gains and long-term challenges in resist, actinic inspection, mask and mask pellicles and light sources.
STMicro, Macom to Begin Sampling GaN-on-Silicon in 2018
ST to manufacture GaN-on-silicon wafers for Macom's use in RF applications.
Wafer Capacity Projected to Increase 6 Percent per Year until 2022
DRAM sales grew by 76.8 percent, NAND 47.5 percent in 2017.
SEMI Highlights Critical Need of New Electronics Manufacturing Talent
“If we do not act together quickly, we will choke our own growth”
Eliminating fractures in 3D printed parts
A new technique microwaves carbon nanotubes sandwiched between 3D printed layers to weld them together and make parts to up…
Europe pushes for sovereignty amidst tech reboot
As China aggressively pushes its own industrial policy, Europe sees it as fair game to consolidate some of its collected…
Who will win in ‘Europe First’ reboot?
A partnership between CEA-Leti and Fraunhofer Group is aimed at funding—not just for themselves but for the microelectronics industry in…
Resolve process variation challenges in multiple patterning
Multiple patterning is an effective method for pitch shrinking now standard in high-volume production. However, as the number of process…
How China gets PCB production costs down
Manufacturing materials require several steps spanning different technologies. Asian factories, specifically those in China, overcome this hurdle with low-cost labour…
Low-loss laminates up signal integrity game
With channel speeds increasing beyond 50Gbps, RO1200 circuit materials are engineered to meet electrical and thermal/mechanical requirements of high speed…