Pre-wafer simulation narrows down semicon process options
The solution from Synopsys allows creation of higher-quality early Process Design Kits (PDKs) for design technology co-optimisation (DTCO).
NXP’s LFPAK33 automotive MOSFET saves up to 80% space
NXP's LFPAK package sets a benchmark in small size with the LFPAK33 MOSFET to power secure connections for automotive OEMs.
Rocket scientist’s guide to RF impedance matching
Here's a look at impedance matching, which is used to make a load or line impedance equal that of a…
Prototype to production: Industrial controller requirements
In this instalment, we present five high level requirements for the IoT industrial controller that will be prototyped in upcoming…
Force sensor design speeds deployment of HMI devices
The MAXREFDES82# reference design from Maxim provides both downward force and centre of mass, by collecting responses from four load…
Avnet debuts feature-packed industrial IoT starter kit
The MicroZed Industrial IoT starter kit packs a development module based on the Xilinx Zynq-7000 SoC that combines dual ARM…
Biotech to spawn computers, hints MIT Media Lab founder
Nicholas Negroponte predicts biotechnology will learn how to grow all things in the future, from communications to transportation, as well…
Start-up promises Google-like data centre management sol’ns
DriveScale, formed by three engineers from Sun Microsystems and Cisco Systems, has developed a software and a network adapter that…
Prototype to production: Arduino for pro developers
Arduino has been key in turning an abstract idea into a defined product. For that reason, let's take a closer…
Programmable ASSPs link displays, mobile image sensors
Lattice's pASSPs combine programmable fabric and programmable I/O for customisation with high-performance MIPI D-PHY cores that can satisfy the demands…