Covid-19: More Closures Hit Asia
Our colleagues in China, Taiwan and other regions in Southeast Asia continue to report, from the ground, on the coronavirus's…
The Importance of Thermal Management for Power Devices
The Cadence Celsius Thermal Solver is the first complete electric-thermal co-simulation solution for the entire hierarchy of electronic systems, from…
Chip Stacks in the Spotlight at Semicon
Chipmakers are turning to packaging to pick up some performance slack as traditional silicon scaling slows.
Intel Shows First Glimpse of Packaging Technologies on Roadmap
Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.
LED Packaging Companies Work on Niche Markets
Mainstream high- and mid-power LED package products in the Chinese market witnessed price declines in December, according to the latest…
Intel demonstrates 10nm Ice Lake CPU
Intel has demonstrated it's 10nm Ice Lake CPU at CES 2019, and promised that PCs incorporating this new processor will…
Intel Refreshes Desktop CPUs
Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.