Diverse topics take centre stage at Hot Chips
The conference's IoT session will include the first of two talks on RISC-V, while five sessions on neural nets architectures…
AI helps convert photos into 3D models
Developed by Purdue University Professor Karthik Ramani's team, the SurfNet method can create 3D content for virtual or augmented reality…
Paragon releases UFSD for Nucleus OS
Paragon's Universal File Systems Drive (UFSD) technology delivers interoperability with popular file systems: FAT, NTFS, exFAT, HFS+, extFS.
Microsoft’s HoloLens 2 will use custom AI chip
The custom silicon is a coprocessor designed by Microsoft that will natively and flexibly implement DNNs, according to the company.
Synopsys HBM2 IP offers up to 307GB/s bandwidth
Built on Synopsys' HBM and DDR4 IP, the complete DesignWare HBM2 platform enables designers to achieve their memory bandwidth, latency…
Samsung’s 6CA LTE modem achieves 1.2Gbps
Samsung's new chip aggregates 6 carriers, boosting maximum downlink speeds to allow full-length HD movie downloads within 10 seconds.
What if your clothes could charge a cellphone?
An ultra-thin energy harvesting system has the potential to do just that. The system fuses atomically thin material into textiles…
NXP adds Amazon Greengrass support for secure IoT
The Amazon Greengrass software extends Amazon Web Service's Cloud capabilities to local devices, allowing them to collect and analyse data…
Compact VNA simplifies S-parameter measurement
The small form-factor R&S ZNLE features a 10.1" WXGA touchscreen and a user-friendly interface.
Eliminating fractures in 3D printed parts
A new technique microwaves carbon nanotubes sandwiched between 3D printed layers to weld them together and make parts to up…