E-waste recyling grapples to cover logistics cost
Low commodity values for materials recovered do not cover the costs of responsible treatment for used electronics.
Energy efficiency: Possible with 3D printing?
EBN talks to author Jack Hornick on how '3D Printing Will Rock the World,' and its energy-saving potential.
Micron stakes business on 3D NAND with new fab process
Micron has taken an innovative approach to shrinking the die area by placing active circuitry under the NAND array.
ICs eliminate need for external voltage dividers
Both controllers offer a programmable minimum-on-time function to ensure reliable operation over a wide range of switching frequencies.
Connectors meet high procurement requirements for RF apps
Over 3,800 connectors from Multicomp are available for dispatch, including AV, circular, I/O, industrial, modular, PCB, RF/coaxial and USB connectors.
Self-refresh DRAM device reduces number of needed pins
The HyperRAM and HyperFlash solution reduces pin count by at least 28 pins, decreasing design complexity and lowering PCB cost.
Bringing performance to software-defined storage with NVMe
Typical enterprise storage buyers are accustomed to a somewhat-appliance like experience, but with software-defined storage, customers can use the hardware…
Next-gen PCIe debate: 25 or 32Gbit/s?
At the time PCI SIG started the 4.0 version it thought it might be its last copper-based chip-to-chip interconnect.
vSoC delivers open source platform for middleware, apps
The Armada 8040 leverages Marvell’s MoChi technology interface to enable driver-transparent expansion beyond the standard device offering.
India PC shipments plummets in 2Q16: Gartner
PC shipments to India totalled about 20.00 lakh (2 million) units in the first quarter of 2016, a 7.4% decrease…