2017-04-25 - EE Times India

Designware IP subsystem adds IoT, sensor support

The Data Fusion IP Subsystem is an integrated, pre-verified hardware and software IP product for devices requiring minimal energy consumption.

2017-04-17 - Upendra Somashekaraiah, Manish Sagarvanshi, Sarvang Sanghavi

Resistance scaling fixes PNR, signoff STA mismatch

Resistance scaling is a powerful tool for meeting timing demands, particularly when there is miscorrelation between PNR and signoff STA…

- Upendra Somashekaraiah, Manish Sagarvanshi, Sarvang Sanghavi

Resistance scaling affects other design parameters

Applying resistance scaling can have side effects on other design parameters, like shorts, DRCs and density.

2017-03-22 - EE Times India

Design software adds headlight safety test

The test capability in LucidShape 2017.03 allows designers to perform illuminance-based visibility range tests and glare test for oncoming traffic.

2017-02-07 - Toshiba

Photorelay offers increased density in smaller boards

Toshiba’s TLP3406S photorelay offers small on-resistance and on/off switching currents of 1.5A in 2.00mm x 1.45mm size.

2017-01-13 - Synopsys

Synopsys Coverity adds Forcheck static analysis

Forcheck technology integrated into Synopsys' Coverity static analysis system provides support to software written in Fortran language.

2016-12-29 - Junko Yoshida

Road to innovating machine learning chips

The AI community is aiming for higher performance and more power efficient inference engines for deep neural networks.

- Junko Yoshida

Realising AI chip goals

CEA believes a neuromorphic circuit is a valid complement to deep learning to extract information from data close to the…

2016-12-07 - Synopsys

Synopsys, IIT develop TCAD model for 5nm FinFET simulation

Synopsys and IIT Bombay have developed the Sentaurus TCAD model for negative-bias temperature instability (NBTI).

2016-11-29 - Vivek Nanda

NXP integrates Mindtree IP in MCU

NXP's Kinetis KW41Z microcontroller incorporates MindTree's 4.2 Bluetooth Smart IP, BlueLitE.